? semiconductor components industries, llc, 2015 june, 2015 ? rev. 17 1 publication order number: mc74vhc1g126/d mc74vhc1g126 noninverting 3-state buffer the mc74vhc1g126 is an advanced high speed cmos noninverting 3 ? state buffer fabricated with silicon gate cmos technology. it achieves high speed operation similar to equivalent bipolar schottky ttl while maintaining cmos low power dissipation. the internal circuit is composed of three stages, including a buf fered 3 ? state output which provides high noise immunity and stable output. the mc74vhc1g126 input structure provides protection when voltages up to 7 v are applied, regardless of the supply voltage. this allows the mc74vhc1g126 to be used to interface 5 v circuits to 3 v circuits. features ? high speed: t pd = 3.5 ns (typ) at v cc = 5 v ? low power dissipation: i cc = 1 a (max) at t a = 25 c ? power down protection provided on inputs ? balanced propagation delays ? pin and function compatible with other standard logic families ? chip complexity: fets = 58; equivalent gates = 15 ? nlv prefix for automotive and other applications requiring unique site and control change requirements; aec ? q100 qualified and ppap capable ? these devices are pb ? free and are rohs compliant figure 1. pinout (top view) v cc oe in a out y gnd in a out y en oe figure 2. logic symbol 1 2 3 5 4 see detailed ordering and shipping information in the package dimensions section on p age 4 of this data sheet. ordering information function table l h x a input y output l h z oe input h h l pin assignment 1 2 3 gnd oe in a 4 5v cc out y www.onsemi.com sc ? 88a / sot ? 353 / sc ? 70 df suffix case 419a tsop ? 5 / sot ? 23 / sc ? 59 dt suffix case 483 marking diagrams 1 5 1 5 1 5 w2 m w2 = device code m = date code* = pb ? free package 1 5 w2 m m (note: microdot may be in either location) *date code orientation and/or position may vary depending upon manufacturing location.
mc74vhc1g126 www.onsemi.com 2 maximum ratings symbol characteristics value unit v cc dc supply voltage ? 0.5 to +7.0 v v in dc input voltage ? 0.5 to +7.0 v v out dc output voltage v cc = 0 high or low state ? 0.5 to 7.0 ? 0.5 to v cc + 0.5 v i ik input diode current ? 20 ma i ok output diode current v out < gnd; v out > v cc +20 ma i out dc output current, per pin +25 ma i cc dc supply current, v cc and gnd +50 ma p d power dissipation in still air sc ? 88a, tsop ? 5 200 mw ja thermal resistance sc ? 88a, tsop ? 5 333 c/w t l lead temperature, 1 mm from case for 10 secs 260 c t j junction temperature under bias +150 c t stg storage temperature ? 65 to +150 c v esd esd withstand voltage human body model (note 1) machine model (note 2) charged device model (note 3) > 2000 > 200 n/a v i latchup latchup performance above v cc and below gnd at 125 c (note 4) 500 ma stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. tested to eia/jesd22 ? a114 ? a 2. tested to eia/jesd22 ? a115 ? a 3. tested to jesd22 ? c101 ? a 4. tested to eia/jesd78 recommended operating conditions symbol characteristics min max unit v cc dc supply voltage 2.0 5.5 v v in dc input voltage 0.0 5.5 v v out dc output voltage 0.0 v cc v t a operating temperature range ? 55 +125 c t r , t f input rise and fall time v cc = 3.3 v 0.3 v v cc = 5.0 v 0.5 v 0 0 100 20 ns/v functional operation above the stresses listed in the recommended operating ranges is not implied. extended exposure to stresse s beyond the recommended operating ranges limits may affect device reliability. device junction temperature versus time to 0.1% bond failures junction temperature c time, hours time, years 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 1 1 10 100 1000 time, years normalized failure rate t j = 80 c t j = 90 c t j = 100 c t j = 110 c t j = 130 c t j = 120 c failure rate of plastic = ceramic until intermetallics occur figure 3. failure rate vs. time junction temperature
mc74vhc1g126 www.onsemi.com 3 dc electrical characteristics symbol parameter test conditions v cc (v) t a = 25 c t a 85 c ? 55 t a 125 c unit min typ max min max min max v ih minimum high ? level input voltage 2.0 3.0 4.5 5.5 1.5 2.1 3.15 3.85 1.5 2.1 3.15 3.85 1.5 2.1 3.15 3.85 v v il maximum low ? level input voltage 2.0 3.0 4.5 5.5 0.5 0.9 1.35 1.65 0.5 0.9 1.35 1.65 0.5 0.9 1.35 1.65 v v oh minimum high ? level output voltage v in = v ih or v il v in = v ih or v il i oh = ? 50 a 2.0 3.0 4.5 1.9 2.9 4.4 2.0 3.0 4.5 1.9 2.9 4.4 1.9 2.9 4.4 v v in = v ih or v il i oh = ? 4 ma i oh = ? 8 ma 3.0 4.5 2.58 3.94 2.48 3.80 2.34 3.66 v v ol maximum low ? level output voltage v in = v ih or v il v in = v ih or v il i ol = 50 a 2.0 3.0 4.5 0.0 0.0 0.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 v v in = v ih or v il i ol = 4 ma i ol = 8 ma 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 v i oz maximum 3 ? state leakage current v in = v ih or v il v out = v cc or gnd 5.5 0.2 5 2.5 2.5 a i in maximum input leakage current v in = 5.5 v or gnd 0 to 5.5 0.1 1.0 1.0 a i cc maximum quiescent supply current v in = v cc or gnd 5.5 1.0 20 40 a product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. ????????????????????????????????? ac electrical characteristics c load = 50 pf, input t r = t f = 3.0 ns ???? ???? ???? symbol ??????? ??????? ??????? ????????? ????????? ????????? ??????? ??????? c ???? ???? 85 c ?????? ?????? ? 55 t a 125 c ?? ?? ?? ??? ??? ??? ??? ??? ??? ?? ?? ??? ??? ??? ??? ???? ???? ???? ???? ???? ???? t plh , t phl ??????? ??????? ??????? ??????? ????????? ????????? ????????? 0.3 v c l = 15 pf c l = 50 pf ??? ??? ??? ??? ??? ??? ??? ??? ??? ?? ?? ?? ??? ??? ??? ??? ??? ??? ???? ???? ???? ?? ?? ?? ?? ????????? ????????? 0.5 v c l = 15 pf c l = 50 pf ??? ??? ??? ??? ??? ??? ?? ?? ??? ??? ??? ??? ???? ???? ???? ???? ???? ???? ???? ??????? ??????? ??????? ??????? ??????? ????????? ????????? ????????? 0.3 v c l = 15 pf r l = 1000 c l = 50 pf ??? ??? ??? ??? ??? ??? ??? ??? ??? ?? ?? ?? ??? ??? ??? ??? ??? ??? ???? ???? ???? ?? ?? ?? ?? ?? ????????? ????????? ????????? 0.5 v c l = 15 pf r l = 1000 c l = 50 pf ??? ??? ??? ??? ??? ??? ??? ??? ??? ?? ?? ?? ??? ??? ??? ??? ??? ??? ???? ???? ???? ???? ???? ???? ???? ??????? ??????? ??????? ??????? ????????? ????????? 0.3 v c l = 15 pf r l = 1000 c l = 50 pf ??? ??? ??? ??? ??? ??? ?? ?? ??? ??? ??? ??? ???? ???? ?? ?? ?? ?? ????????? ????????? ????????? 0.5 v c l = 15 pf r l = 1000 c l = 50 pf ??? ??? ??? ??? ??? ??? ??? ??? ??? ?? ?? ?? ??? ??? ??? ??? ??? ??? ???? ???? ???? ???? ???? ??????? ??????? ????????? ????????? ??? ??? ??? ??? ??? ??? ?? ?? ??? ??? ??? ??? ???? ???? ?? ?? ???? ???? ???? ??????? ??????? ??????? ? state output capacitance (output in high impedance state) ????????? ????????? ????????? ??? ??? ??? ??? ??? ??? ??? ??? ??? ?? ?? ?? ??? ??? ??? ??? ??? ??? ???? ???? ???? ?? ?? ?? typical @ 25 c, v cc = 5.0 v pf 8.0 5. c pd is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption with out load. average operating current can be obtained by the equation: i cc(opr ) = c pd v cc f in + i cc . c pd is used to determine the no ? load dynamic power consumption; p d = c pd v cc 2 f in + i cc v cc .
mc74vhc1g126 www.onsemi.com 4 switching waveforms figure 4. switching waveforms figure 5. y 50% 50% v cc 50% v cc v cc gnd high impedance v ol + 0.3v v oh - 0.3v y y oe t pzl t plz t pzh t phz *includes all probe and jig capacitance c l * test point device under test output figure 6. test circuit *includes all probe and jig capacitance figure 7. test circuit output test point c l * 1 k connect to v cc when testing t plz and t pzl. connect to gnd when testing t phz and t pzh. device under test high impedance 50% 50% v cc v cc gnd t plh t phl a figure 8. input equivalent circuit input ordering information device package shipping ? m74vhc1g126dft1g sc ? 88a/sot ? 353/sc ? 70 (pb ? free) 3000 units / tape & reel nlvvhc1g126dft1g* sc ? 88a/sot ? 353/sc ? 70 (pb ? free) m74vhc1g126dft2g sc ? 88a/sot ? 353/sc ? 70 (pb ? free) M74VHC1G126DTT1G tsop ? 5/sot ? 23/sc ? 59 (pb ? free) ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *nlv prefix for automotive and other applications requiring unique site and control change requirements; aec ? q100 qualified and ppap capable
mc74vhc1g126 www.onsemi.com 5 package dimensions sc ? 88a (sc ? 70 ? 5/sot ? 353) case 419a ? 02 issue l notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 419a ? 01 obsolete. new standard 419a ? 02. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. dim a min max min max millimeters 1.80 2.20 0.071 0.087 inches b 1.15 1.35 0.045 0.053 c 0.80 1.10 0.031 0.043 d 0.10 0.30 0.004 0.012 g 0.65 bsc 0.026 bsc h --- 0.10 --- 0.004 j 0.10 0.25 0.004 0.010 k 0.10 0.30 0.004 0.012 n 0.20 ref 0.008 ref s 2.00 2.20 0.079 0.087 b 0.2 (0.008) mm 12 3 4 5 a g s d 5 pl h c n j k ? b ? mm inches scale 20:1 0.65 0.025 0.65 0.025 0.50 0.0197 0.40 0.0157 1.9 0.0748 solder footprint
mc74vhc1g126 www.onsemi.com 6 package dimensions tsop ? 5 case 483 ? 02 issue k notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. mold flash, protrusions, or gate burrs shall not exceed 0.15 per side. dimension a. 5. optional construction: an additional trimmed lead is allowed in this location. trimmed lead not to extend more than 0.2 from body. dim min max millimeters a 3.00 bsc b 1.50 bsc c 0.90 1.10 d 0.25 0.50 g 0.95 bsc h 0.01 0.10 j 0.10 0.26 k 0.20 0.60 m 0 10 s 2.50 3.00 123 54 s a g b d h c j 0.7 0.028 1.0 0.039 mm inches scale 10:1 0.95 0.037 2.4 0.094 1.9 0.074 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 0.20 5x c ab t 0.10 2x 2x t 0.20 note 5 c seating plane 0.05 k m detail z detail z top view side view a b end view publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 mc74vhc1g126/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative on semiconductor and the are registered trademarks of semiconductor components industries, llc (scillc) or its subsidia ries in the united states and/or other countries. scillc owns the rights to a number of pa tents, trademarks, copyrights, trade secret s, and other intellectual property. a listin g of scillc?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warrant y, representation or guarantee regarding the suitability of it s products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typi cal? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating param eters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgic al implant into the body, or other applications intended to s upport or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer s hall indemnify and hold scillc and its officers , employees, subsidiaries, affiliates, and dist ributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufac ture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner.
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